Florian Herrault
Florian Herrault
Group Leader, Advanced Packaging Solutions, HRL Laboratories

My research area is in millimeter-wave microelectronic devices, and my group develops 2.5D and 3D packaging technologies for improved subsystem performance. In other words, my work makes digital and analog devices run more efficiently.

I had the opportunity to attend the FOE Symposium a few years ago. It was a very intellectually and creatively stimulating event, which I enjoyed very much. Flying back, I kept asking myself about the greater impact of my research work, and this event helped me refocus on the importance of the work done with my team.

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